Exterior / Preparation
Improved heavy cutting compound with low secondary defects.
Q²M Compound+ REDEFINED is a heavy cutting paste designed to deliver strong and fast defect removal with very low dust and limited secondary defects. While it can leave light holograms, these are easy to remove with a single pass of a finishing polish.
A heavy cut compound with lots of power and low secondary defects.
Q²M Compound+ REDEFINED improves correction efficiency by combining high abrasion with controlled finishing behaviour. Its refined, water based formula supports faster work, clean residue removal and reliable preparation before further polishing or coating.
TECHNICAL DETAILS
CAPACITIES
120 ML / 250 ML / 1000 ML
Cut
Finish
Consumption
15-40ML/PANEL
HOW TO USE
Q
2
M
COMPOUND+ REDEFINED
01
Apply a small amount of Q²M Compound+ REDEFINED to a polishing pad. 02
Work the product using correct machine and pad combination. 03
Polish until defects are removed and the product is worked through. 04
Wipe off residue with a clean microfibre towel. 05
Follow with a finishing polish if required. Watch
product
video
FREQUENTLY ASKED
QUESTIONS
QUESTIONS
01
What type of defects is Q²M Compound+ REDEFINED designed for? Severe scratches and heavy paint defects.
02
Does it produce a lot of dust? No. It is formulated to keep dust levels low.
03
Will it leave holograms? It may leave light holograms that are easy to remove.
04
Does it contain fillers or silicone? No. It is filler free and silicone free.
05
Is it suitable before coating application? Yes. It leaves a clean surface ready for further steps.
